Pushing the Limits of Miniaturization – Stress-Free PCBA Separation
Laser technology enables stress-free, precise, and particle-free depaneling of assembled PCBs. Even complex geometries in FR4 and flex materials can be reliably processed – making it ideal for miniaturization.
Assembled printed circuit boards (PCBA) are usually manufactured in panels. For further processing, clean and reliable depaneling is essential.
With state-of-the-art laser technology, PCBs can be separated precisely and in a material-friendly way – whether FR4 boards or flexible flex PCBs. Even complex geometries can be realized with ease.
The laser operates stress-free, particle-free, and without mechanical strain. This ensures that the full quality of sensitive assemblies is preserved – a key advantage, especially in medical technology applications.
The combination of highest precision and gentle processing enables the implementation of fine structures and miniaturization without compromising process reliability.
Visit us at booth D2111 in hall 2 and learn how precise laser depaneling opens up new design freedom in PCBA manufacturing.
