Microdul AG, Zürich, Schweiz

Microdul AG, Zürich, Schweiz

Short description

Microdul AG - Your trusted partner for advanced microelectronics. We master the processes at all implementation stages — from development and engineering through production and test of custom applications. We strive to delight and inspire our customers.

Standards, Products, Services

  • S ISO 9001:2015
  • S EKAS 6508
  • S ISO 13485:2016
  • P Sensors
  • P Optoelectronics
  • P Further electronics and sensors
  • S Prototyping
  • S Clean room production
  • S Microscopic material analysis
  • S Technology development
  • S Consulting
  • S Entire systems
  • S Circuits
  • S Embedded systems
  • S Electronic systems
  • S Contract manufacturing electronics
  • S Part testing
  • S Assembly

About us

Microdul AG possesses a broad and pro-found know-how in the multi-faceted world of micro-electronics. In our business areas of semiconductors, modules and thick-film, we convert this know-how into fascinating products and services. Certifications in ISO 9001 and ISO 13485 are witnesses to our process excellence — as well as the numerous, successful customer audits. Whether you need a standard pro-duct or an individual solution — with Microdul as your partner, you will successfully cope with any hurdle.

Microdul masters the following process technologies and more:

  • Miniaturisation of electronics
  • Substrate Design
  • Die and Wire Bonding (Al, Au), 15-350 um Wire Diameter
  • Chip on Chip (COC), Chip on Ceramic, Chip on Board (COB), Chip on Flex (COB), Package on Package (POP)
  • Globtop coating
  • Flip chip assembly 150um pitch
  • SMD mounting, 01005 Packages (0.2 x 0.4mm)
  • Stud Bumping (Au) on Die and Wafer.
  • Assembly on different substrates; flex rigid, thick film, thin film, Ceramic packages, direct copper bonding DCB
  • Solder Ball Attach (BGA)
  • Vacuum soldering (for power applications, CPV)
  • Hand soldering
  • Adhesive joining
  • Heat sealing
  • Laser trimming (active/passive)      
  • Module potting
  • 100% Functional testing
  • Failure analysis (X-Ray, X Section
  • ISO 9001, ISO 13485 (quality management system for medical modules)
  • ASIC Design (Low-Power, mixed Signal Arrays)
  • Wafer Service, Microdul multiprojekt-wafer (MPW)